Title:
クライオポンプおよび半導体製造装置
Document Type and Number:
Japanese Patent JP4430042
Kind Code:
B2
Abstract:
A cryopump is disclosed. The cryopump includes a cryopump main body connected to a vacuum chamber via an inlet. The cryopump main body includes a vacuum container. A shielding section, a two-stage type cryogenic cooler, a baffle, and first cryopanel and second cryopanels are provided in the vacuum container. A top surface of the first cryopanel is disposed at a position nearest to a surface of the baffle. The top surface of the first cryopanel is disposed almost parallel to the surface of the baffle.
Inventors:
Hidekazu Tanaka
Application Number:
JP2006158619A
Publication Date:
March 10, 2010
Filing Date:
June 07, 2006
Export Citation:
Assignee:
Sumitomo Heavy Industries Ltd.
International Classes:
F04B37/08
Domestic Patent References:
| JP59501223A | ||||
| JP6329069A | ||||
| JP6035190A | ||||
| JP294381U | ||||
| JP6246710B2 |
Attorney, Agent or Firm:
Tadahiko Ito