Title:
粒状合成樹脂材料の結晶乾燥装置
Document Type and Number:
Japanese Patent JP3993360
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a drying apparatus capable of controlling a temperature, saving energy and preventing chips from being solidified in relation to an apparatus for crystallizing and drying granular synthetic resin materials. SOLUTION: A drying apparatus 1 comprises: a hopper 10 composed of a right circular cylinder-shaped first cylindrical portion 11 provided at an upper part of the hopper, a tapered cylindrical portion 12 whose diameter is gradually made narrow downwardly and which is provided connectively to the underside of the first cylindrical portion, and a right circular cylinder-shaped second cylindrical portion 13 which is provided connectively to the underside of the tapered cylindrical portion and whose lower part is formed into an inverted conical shape; a hot air impingement member 23 which is disposed inside the hopper and whose inverted conical part 26 provided at least at a lower half part thereof is positioned inside an inverted conical portion 14 located at a lower part of the hopper; an agitating member 20 composed of a shaft 21 extending upward from the hot air impingement member and blades 22 extending laterally from this shaft; hot air feed pipes 31 for feeding hot air to the inverted conical portion of the hopper; a plurality of first cold air feed pipes 50 which are provided on the circumference of a cylindrical part located in the vicinity of the boundary between the first cylindrical portion of the hopper and the tapered cylindrical portion thereof and which feed cold air into the hopper; and a plurality of second cold air feed pipes 60 which are provided on the circumference of a cylindrical part located in the vicinity of the boundary between the tapered cylindrical portion of the hopper and the second cylindrical portion thereof and which feed cold air into the hopper.
More Like This:
| WO/2000/021862 | CHIP BIN |
| JP2544848 | TREATMENT OF RESIDUAL RAW MATERIAL OF MOVING HOPPER TYPE MOLDING MACHINE |
Inventors:
Taizo Miyazaki
Application Number:
JP2000110870A
Publication Date:
October 17, 2007
Filing Date:
April 12, 2000
Export Citation:
Assignee:
Taizo Miyazaki
International Classes:
B65D88/26; B29B13/06; F26B3/16; F26B17/14; F26B21/00
Domestic Patent References:
| JP10253257A | ||||
| JP5345320A | ||||
| JP63078707A | ||||
| JP7332851A | ||||
| JP51025377B1 |
Attorney, Agent or Firm:
Tamako Tsutada
Masato Tsuda
Masato Tsuda