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Patent Searching and Data


Title:
A Cu-Ga sputtering target and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6007840
Kind Code:
B2
Inventors:
安藤 彰朗
坂本 広明
Application Number:
JP2013062675A
Publication Date:
October 12, 2016
Filing Date:
March 25, 2013
Export Citation:
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Assignee:
新日鐵住金株式会社
International Classes:
C23C14/34; B22D19/00; B22D19/16; C22C9/00; C22C47/08; C22C47/20
Domestic Patent References:
JP2012229453A
JP2008138232A
JP2011149039A
JP2004002938A
JP2013155424A
Foreign References:
WO2012086661A1
Attorney, Agent or Firm:
國分 孝悦