To provide a Cu-Ni-organic electrodeposited thin film stacked structure in which an organic electrodeposited thin film such as an electrodeposited polyimide thin film having excellent adherability is deposited on a Cu-base material.

In the Cu-Ni-organic electrodeposited thin film stacked structure, an organic electrodeposited thin film is deposited on the Cu-base material through a Ni-layer having a thickness of 1 m. A method for forming the Cu-Ni-organic electrodeposited thin film stacked structure comprises: forming a Ni-layer having a thickness of 1 m on the Cu-base material; then bringing the Ni-layer into contact with an electrodeposition solution of an anionic material; and electrodepositing the anionic material on the Ni-layer by using the Cu-base material, on which the Ni-layer is formed, as an anode to deposit the organic electrodeposited thin film.