Title:
Cu-Ni-Si ALLOY-TINNED STRIP
Document Type and Number:
Japanese Patent JP2007291458
Kind Code:
A
Abstract:
To provide a Cu-Ni-Si-based alloy-tinned strip in which the thermal peeling resistance of tinning is improved.
In the tinned strip using a copper-based alloy comprising, by mass, 1.0 to 4.5% Ni and 0.2 to 1.0% Si, and the balance Cu with inevitable impurities as a base metal, the concentration of S and the concentration of C in the boundary face between the plating layer and the base metal are controlled to ≤0.05%. The base metal may further comprise at least one selected from the group consisting of Sn, Zn, Mg, Fe, Mn, Co, Ti, Cr, Zr, Al and Ag in the range of 0.005 to 3.0% in total.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
HATANO TAKATSUGU
Application Number:
JP2006121848A
Publication Date:
November 08, 2007
Filing Date:
April 26, 2006
Export Citation:
Assignee:
NIKKO KINZOKU KK
International Classes:
C22C9/06; B21B3/00; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22F1/08; C25D7/00; H01H1/025; H01H1/04; H01R13/03; C22F1/00; H01B5/02
Domestic Patent References:
| JP2004300524A | 2004-10-28 | |||
| JP2003293187A | 2003-10-15 | |||
| JP2005105419A | 2005-04-21 | |||
| JP2002317295A | 2002-10-31 | |||
| JP2005048262A | 2005-02-24 | |||
| JP2004232049A | 2004-08-19 | |||
| JP2007092173A | 2007-04-12 | |||
| JP2005350774A | 2005-12-22 | |||
| JP2004068026A | 2004-03-04 | |||
| JP2000169996A | 2000-06-20 | |||
| JPH0559468A | 1993-03-09 | |||
| JPH03223482A | 1991-10-02 |
Attorney, Agent or Firm:
Motohiro Kurauchi
Endo Azusa
Takumi Yoshida
Taku Nakajima
Endo Azusa
Takumi Yoshida
Taku Nakajima
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