Title:
Cu-Ti-BASED COPPER ALLOY AND PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP2015054997
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To raise a conductive level of a Cu-Tu-based copper alloy without needs for a specific aging treatment condition.SOLUTION: There is provided an age-hardening Cu-Ti-based copper alloy composition having a Ti content of 1.0 to 7.5 mol% and containing N with an N/Ti mol ratio in the range of 0.03 to 0.50. A Cu-Ti-based copper alloy aging treatment material having an area ratio of the Cu-Ti-based grain boundary reaction deposit of 10% or less, a Vickers hardness of 250 HV or more and conductivity of 20% IACS or more is obtained from the composition by using a general aging treatment equipment.
Inventors:
CHIHOSHI SATOSHI
KO IRIN
KO IRIN
Application Number:
JP2013189885A
Publication Date:
March 23, 2015
Filing Date:
September 12, 2013
Export Citation:
Assignee:
UNIV TOHOKU
DOWA HOLDINGS CO LTD
DOWA HOLDINGS CO LTD
International Classes:
C22C9/00; C22F1/08
Domestic Patent References:
| JPH03247731A | 1991-11-05 | |||
| JPH04251693A | 1992-09-08 | |||
| JP2010232499A | 2010-10-14 | |||
| JP2007302994A | 2007-11-22 | |||
| JPH06256871A | 1994-09-13 | |||
| JP2009242881A | 2009-10-22 |
Attorney, Agent or Firm:
Komatsu Quantity
Kenji Wada
Kenji Wada