Title:
CU BASED SUBSTRATE FOR ELECTRIC CIRCUIT BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPS6380412
Kind Code:
A
Inventors:
SHIGA SHOJI
SATO KADOMASA
SHIRAKAWA AKITOMO
SATO KADOMASA
SHIRAKAWA AKITOMO
Application Number:
JP22519386A
Publication Date:
April 11, 1988
Filing Date:
September 24, 1986
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C22C9/00; C22C18/00; C23C30/00; H01B5/02; H01B13/00; H05K1/09; H05K3/38; (IPC1-7): C22C9/00; C22C18/00; C23C30/00; H01B5/02; H01B13/00; H05K1/09