Title:
Ｃｕ核ボール、はんだペーストおよびはんだ継手
Document Type and Number:
Japanese Patent JP5590259
Kind Code:
B1
Abstract:
A Cu core ball suppresses a soft error and its alpha dose is low. Its surface roughness does not affect a mounting process. A pure degree of the Cu ball as an internal ball is equal to or larger than 99.9% and equal to or less than 95%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is equal to or higher than 0.95. A solder plating film coated on the Cu ball is a Sn solder plating film or a solder plating film comprising a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is equal to or less than 5 ppb and that of Th is equal to or less than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is equal to or less than 0.0200 cph/cm 2 . An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 µm.
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Inventors:
Hiroyoshi Kawasaki
Takahiro Rotsupongi
Daisuke Soma
Isamu Sato
Takahiro Rotsupongi
Daisuke Soma
Isamu Sato
Application Number:
JP2014013528A
Publication Date:
September 17, 2014
Filing Date:
January 28, 2014
Export Citation:
Assignee:
Senju metal industry incorporated company
International Classes:
B22F1/17; B22F9/08; B22F9/14; B23K35/14; B23K35/22; B23K35/26; B23K35/30; C22C9/00; C22F1/00; C22F1/08
Attorney, Agent or Firm:
Patent business corporation Yamaguchi international patent firm