Title:
硬化性接着性副木および方法
Document Type and Number:
Japanese Patent JP2004505723
Kind Code:
A
Abstract:
Curable adhesive splints, methods of manufacturing the splints and methods of using the splints are disclosed. The splints include a curable splinting layer and an exposed pressure sensitive adhesive proximate a first major side of the splinting layer. The pressure sensitive adhesive is used to secure the curable layer in position to provide the desired immobilization. The curable splinting layer may be of any material that can be shaped and cured to provide the desired level of stiffness required for immobilization, such as, e.g., moisture-curable splinting material, etc. The curable adhesive splints may be molded or formed to a desired shape while still providing the stiffness required for immobilization after curing.
Inventors:
Shin, Barber
Baek, Lim Fan
Arenberg, Cart
Baek, Lim Fan
Arenberg, Cart
Application Number:
JP2002518885A
Publication Date:
February 26, 2004
Filing Date:
February 15, 2001
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
A61F5/01; A61F5/058; (IPC1-7): A61F5/01
Attorney, Agent or Firm:
Takashi Ishida
Jun Tsuruta
Masaya Nishiyama
Higuchi Souji
Jun Tsuruta
Masaya Nishiyama
Higuchi Souji