Title:
硬化性組成物、電子部品及び電子部品の製造方法
Document Type and Number:
Japanese Patent JP7092667
Kind Code:
B2
Abstract:
Provided is a curable composition that makes it possible to obtain: a curable film that is highly heat resistant; a curable film that is highly light reflective; and a curable film that, even when exposed to high temperatures, can maintain the high light-reflectivity thereof and that has high insulation reliability. This curable composition includes a curable component, titanium oxide, and an inorganic filler other than titanium oxide. The iron concentration in the curable composition is 100 ppm or less.
Inventors:
Takashi Nishimura
Hiroshi Maenaka
Takashi Kage
▲高▼橋 駿夫
Nakamura Hide
Hiroshi Maenaka
Takashi Kage
▲高▼橋 駿夫
Nakamura Hide
Application Number:
JP2018529666A
Publication Date:
June 28, 2022
Filing Date:
May 10, 2018
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08F299/00; C08F290/06; G03F7/004; G03F7/032
Domestic Patent References:
| JP2011158628A | ||||
| JP2016024284A | ||||
| JP2010270185A | ||||
| JP2011052154A | ||||
| JP2015072468A | ||||
| JP2016204631A | ||||
| JP2012138251A | ||||
| JP201559983A | ||||
| JP2016136248A | ||||
| JP2017141472A |
Foreign References:
| WO2016098797A1 | ||||
| WO2017090680A1 |
Attorney, Agent or Firm:
特許業務法人 宮▲崎▼・目次特許事務所