Title:
CURABLE COMPOSITE MATERIAL AND CIRCUIT BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2005089633
Kind Code:
A
Abstract:
To provide a circuit board having heat resistance and moist resistance superior to the conventional ones.
A curable resin composition comprises (1) an epoxy resin which is a diglycidol derivative having a naphthalene structure as a main skeleton, (2) a phenol-novolak resin, a cresol-novolak resin or a bisphenol A-novolak resin, (3) a bismaleimide resin and (4) 2,3-dihydro-1-H-pyrrolo[1,2-a]benzimidazole. The subject curable composite material comprises the curable resin composition and an inorganic filler. The circuit board is obtained by using the curable composite material. The circuit board is preferably a metal-based circuit board, and has 180-200°C maximum allowable working temperature.
Inventors:
MIYASHITA YASUO
OGUMA TAKEMI
INO YUKO
OGUMA TAKEMI
INO YUKO
Application Number:
JP2003326047A
Publication Date:
April 07, 2005
Filing Date:
September 18, 2003
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C08K3/00; C08G59/24; C08G59/62; C08L63/00; H01L23/14; H05K1/03; H05K1/05; (IPC1-7): C08G59/62; C08G59/24; C08K3/00; C08L63/00; H01L23/14; H05K1/03; H05K1/05