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Patent Searching and Data


Title:
CURABLE COMPOSITE MATERIAL CONTAINING POLYPHENYLENE ETHER RESIN
Document Type and Number:
Japanese Patent JPH07258537
Kind Code:
A
Abstract:

PURPOSE: To obtain a composite material which gives a cured item excellent in flame retardance, dielectric characteristics, and heat resistance by combining a substrate with a resin compsn. comprising polyphenylene ether, a specific flame retardant, and a thermosetting monomer and/or a thermosetting resin.

CONSTITUTION: A curable polyphenylene ether resin compsn. is prepd. by compounding 100 pts.wt. compsn. comprising polyphenylene ether and at least one thermosetting monomer and/or a thermosetting resin with 5-100 pts.wt. compd. of the formula (wherein m and n are each 3-5 provided m+n is 8 or higher; and Z is a 4C or lower optionally brominated alkylene group). The compsn. is used for preparing a curable composite material contg. 5-90wt.% substrate. The material is molded and cured at 80-300°C under a pressure of 0.1-1000kg/cm2 for 1min to 10hr to give a cured composite material, which is laminated to a metal foil to give a resin laminate.


Inventors:
KATAYOSE TERUO
ARAI YUSHI
Application Number:
JP5701294A
Publication Date:
October 09, 1995
Filing Date:
March 28, 1994
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
B32B15/08; C08K5/03; C08L71/12; C08L101/00; H05K1/03; (IPC1-7): C08L71/12; B32B15/08; C08K5/03; C08L101/00