Title:
チオール化合物を含有する硬化性組成物
Document Type and Number:
Japanese Patent JP5301164
Kind Code:
B2
Abstract:
The present invention relates to a curable composition having high adhesiveness and transparency, comprising a thiol compound containing two or more groups represented by formula (1):
wherein the symbols in the formula have the meanings as described in the specification; and
an urethane compound containing an ethylenically unsaturated double bond represented by formula (2):
wherein the symbols in the formula have the meanings as described in the specification.
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Inventors:
Hideo Miyata
Urakawa Katsuro
Haruhiko Ikeda
Youtaro Hattori
Urakawa Katsuro
Haruhiko Ikeda
Youtaro Hattori
Application Number:
JP2007555996A
Publication Date:
September 25, 2013
Filing Date:
January 25, 2007
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
C08G75/04; C08G75/045; G02B1/04
Domestic Patent References:
| JP2000206301A | 2000-07-28 | |||
| JPH1121352A | 1999-01-26 | |||
| JPH10332901A | 1998-12-18 | |||
| JPH0593070A | 1993-04-16 | |||
| JPH04266927A | 1992-09-22 |
Foreign References:
| WO2003072614A2 | 2003-09-04 |
Attorney, Agent or Firm:
Kunihisa Landlord
Atsushi Hayashi
Atsushi Hayashi