Title:
CURABLE COMPOSITION AND CURING MATERIAL
Document Type and Number:
Japanese Patent JP2015101603
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a curable composition capable of suppressing migration of a plasticizer without requiring to melt the plasticizer at a high temperature, and to provide a curing material and a wire harness.SOLUTION: There is provided a curable composition which comprises a chain transfer agent having a structure represented by the formula (1), a vinyllactam compound represented by the formula (2), a (meth)acylate component, and a polymerization initiator, wherein the amount of the vinyllactam compound is 1 to 50 mass% of the resin component amount. (R1, if present, represents H and if not present, may form a double bond with the adjacent atom; R3, if present, represents C, O, N and S and if not present, the C and N in the formula may form a double bond; and R5 represents [-(CH)-] or [-CH-CH-NH-]).
Inventors:
NAKAJIMA KAZUO
HASE TATSUYA
KATO YOSHITO
MIZOGUCHI MAKOTO
HASE TATSUYA
KATO YOSHITO
MIZOGUCHI MAKOTO
Application Number:
JP2013240951A
Publication Date:
June 04, 2015
Filing Date:
November 21, 2013
Export Citation:
Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
UNIV KYUSHU
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
UNIV KYUSHU
International Classes:
C08F220/18; C08F226/06; C08F290/06
Domestic Patent References:
| JP2011113693A | 2011-06-09 | |||
| JP2011113694A | 2011-06-09 | |||
| JP2013060523A | 2013-04-04 | |||
| JP2013060522A | 2013-04-04 | |||
| JP2009210636A | 2009-09-17 | |||
| JP2011113692A | 2011-06-09 | |||
| JP2010235817A | 2010-10-21 | |||
| JP2000072833A | 2000-03-07 | |||
| JP2006117826A | 2006-05-11 |
Foreign References:
| US20130338327A1 | 2013-12-19 |
Attorney, Agent or Firm:
Noboru Ueno