Title:
CURABLE COMPOSITION AND ITS CURED PRODUCT
Document Type and Number:
Japanese Patent JP2002317047
Kind Code:
A
Abstract:
To obtain a curable composition which has a curable property even at a low temperature of -20 to 5°C, can rapidly cure at the ordinary temperature, and gives a cured product having an improved pot life and good physical properties such as good water resistance, chemical resistance and adhesiveness.
The curable composition comprises (A) a compound having two or more specific heterocyclic groups in the molecule, (B) a compound having an electrophilic group capable of reacting with a thiol group or an -S- group in the molecule, and (C) a compound having one nucleophilic group in the molecule.
Inventors:
WATANABE TETSUYA
Application Number:
JP2001122183A
Publication Date:
October 31, 2002
Filing Date:
April 20, 2001
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08K5/00; C08G75/00; C08L81/00; C08L101/00; C09D7/12; C09D163/00; C09D181/00; C09D191/06; C09D201/02; C09J11/00; C09J163/00; C09J181/00; C09J191/06; C09J201/02; (IPC1-7): C08G75/00; C08K5/00; C08L81/00; C08L101/00; C09D181/00
Domestic Patent References:
JP2000273150A | 2000-10-03 | |||
JP2001019900A | 2001-01-23 | |||
JP2001106966A | 2001-04-17 | |||
JP2001040331A | 2001-02-13 |
Foreign References:
WO1999054373A1 | 1999-10-28 |