Title:
硬化性組成物及びその硬化物
Document Type and Number:
Japanese Patent JP6955232
Kind Code:
B2
Abstract:
Provided are: a curable composition which exhibits excellent heat resistance and dielectric properties in a cured product; a cured product of the curable composition; and a printed circuit board, a semiconductor sealing material, and a build-up film that use the curable composition. Specifically, provided are: a curable composition which comprises a polymerizable unsaturated bond-containing aromatic ester compound (A) and a polyarylene ether resin (B); a cured product of the curable composition; and a printed circuit board, a semiconductor sealing material, and a build-up film that use the curable composition.
Inventors:
Kazuhisa Yamoto
Yasushi Sato
Koji Hayashi
Yasushi Sato
Koji Hayashi
Application Number:
JP2020509889A
Publication Date:
October 27, 2021
Filing Date:
March 14, 2019
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08F2/44; C08G59/18; C08L25/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP11349788A | ||||
| JP2000194070A | ||||
| JP2016534166A | ||||
| JP2008524867A | ||||
| JP9194545A |
Foreign References:
| WO2017126417A1 | ||||
| WO2014203511A1 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office