Title:
CURABLE COMPOSITION, PRODUCTION METHOD OF COMPOSITE PARTICLE, HEAT-CONDUCTIVE MATERIAL, HEAT-CONDUCTIVE SHEET, AND DEVICE WITH HEAT-CONDUCTIVE LAYER
Document Type and Number:
Japanese Patent JP2023055252
Kind Code:
A
Abstract:
To provide a curable composition capable of forming a heat-conductive material excellent in heat conductivity and also adhesion, a production method of a composite particle, a heat-conductive material, a heat-conductive sheet, and a device with a heat-conductive layer.SOLUTION: A curable composition includes: a curable compound; and a composite particle, where the composite particle includes a particle X, and a polymeric compound Y which covers at least a part of the surface of the particle X, the particle X includes a particle selected from boron nitride having a particle size D50 of larger than 10 μm, and an agglomerate thereof, and the average molecular weight of the polymeric compound Y is 1,000 or more.SELECTED DRAWING: None
Inventors:
HITOMI SEIICHI
TAKAHASHI KEITA
HAYASHI DAISUKE
TAKAHASHI KEITA
HAYASHI DAISUKE
Application Number:
JP2021164442A
Publication Date:
April 18, 2023
Filing Date:
October 06, 2021
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
C08L63/00; C08F2/00; C08F2/38; C08F2/44; C08F292/00; C08F293/00; C08K3/38; C08K5/13; C08K9/04
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mihashi
Fumio Mihashi