Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP3770689
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a curable composition suitable for alkali development, exhibiting high glass transition temperature, and suitable for, e.g. an insulating material for a laminated circuit board by blending a copolymer which comprises a copolymer of a maleimide compound and a polymerizable compound having ethylenically unsaturated bonds and which has carboxyl groups with a compound having two or more epoxy groups.
SOLUTION: A copolymer consisting of 5-95 wt.% repeating units represented by formula I, 5-95 wt.% repeating units represented by formula II, and 0-50 wt.% repeating units represented by formula III [R1, R3 and R4 are each H or methyl; R2 is a 1-18C alkylene, cycloalkylene, or arylene; X1 and X2 are each H, a 1-4C alkyl, or COOH, and X3 is COOH, CONR5R6 (R5 and R6 are each H or a 1-8C alkyl), or COOR7 (wherein R7 is a 1-4C alkyl), provided that any one of X1, X2 and X3 is COOH; and n is 0 or 1] is blended with a compound having two or more epoxy groups.
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Inventors:
Mitsuo Akutsu
Nobuhide Tominaga
Seiichi Saito
Nobuhide Tominaga
Seiichi Saito
Application Number:
JP7404197A
Publication Date:
April 26, 2006
Filing Date:
March 26, 1997
Export Citation:
Assignee:
Asahi Denka Kogyo Co., Ltd.
International Classes:
C08G59/42; C08L25/18; C08L33/02; C08L33/08; C08L33/24; C08L33/26; C08L35/00; C08L63/00; (IPC1-7): C08L63/00; C08L25/18; C08L33/02; C08L33/08; C08L33/24; C08L33/26; C08L35/00
Domestic Patent References:
| JP7005302A | ||||
| JP61250008A | ||||
| JP2058512A | ||||
| JP62267350A | ||||
| JP2140209A |
Attorney, Agent or Firm:
Osamu Hatori
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