PURPOSE: To produce a curable composition suitable as adhesive for bonding securely chips on a printed board, by employing a specific mixture system as thermal polymerization initiator in a curable composition which comprises a polymerizable prepolymer, a reactive diluent, a photopolymerization initiator, and a thermal polymerization initiator.
CONSTITUTION: In a curable composition which comprises a polymerizable prepolymer, a reactive diluent, a photopolymerization initiator, and a thermal polymerization initiator, a mixture system as the thermal polymerization initiator is used which comprises at least 10W50wt.% (based on the mixture system) alkyl perester. As other thermal polymerization initiator in the above system, a combination of cumene hydroperoxide with a curing promotor or an organic peroxide which has an activation energy at the time of the thermal decomposition in the range of about 30W35kcal/mol can be mentioned.
KAWANO TAKAYUKI
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