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Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JPH01113402
Kind Code:
A
Abstract:

PURPOSE: To produce a curable composition suitable as adhesive for bonding securely chips on a printed board, by employing a specific mixture system as thermal polymerization initiator in a curable composition which comprises a polymerizable prepolymer, a reactive diluent, a photopolymerization initiator, and a thermal polymerization initiator.

CONSTITUTION: In a curable composition which comprises a polymerizable prepolymer, a reactive diluent, a photopolymerization initiator, and a thermal polymerization initiator, a mixture system as the thermal polymerization initiator is used which comprises at least 10W50wt.% (based on the mixture system) alkyl perester. As other thermal polymerization initiator in the above system, a combination of cumene hydroperoxide with a curing promotor or an organic peroxide which has an activation energy at the time of the thermal decomposition in the range of about 30W35kcal/mol can be mentioned.


Inventors:
FUJII RYUICHI
KAWANO TAKAYUKI
Application Number:
JP27056787A
Publication Date:
May 02, 1989
Filing Date:
October 27, 1987
Export Citation:
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Assignee:
SOMAR CORP
International Classes:
C08F2/48; C08F4/28; C08F4/32; C08F290/14; C08F299/04; C09J4/00; H05K3/30; (IPC1-7): C08F2/48; C08F4/32; C09J3/14
Attorney, Agent or Firm:
Toshiaki Ikeura (1 outside)