Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JPH07196891
Kind Code:
A
Abstract:

PURPOSE: To obtain a curable composition having remarkably excellent mechanical properties and adhesiveness and excellent in workability by mixing a polyether, an epoxidized polymerizable unsaturated monomer, a curing agent and a silicon compound.

CONSTITUTION: This composition consists of a polyether (A) containing at least one reactive silyl group in the molecule, a polymer (B) obtained by polymerizing an epoxidized polymerizable unsaturated monomer having at least one epoxy group in the molecule or its mixture with other polymerizable unsaturated monomer, a curing agent (C) for epoxy resin, and a silicon compound (D) containing at least one epoxy group or functional group capable of reacting with an epoxy group and at least one reactive silyl group in the molecule. A cure accelerating catalyst that accelerates the cure reaction of the reactive silyl group can be used in the composition to accelerate the cure with moisture.


Inventors:
HIGUCHI TOSHIHIKO
MUROHASHI TOMOKO
DOI TAKAO
Application Number:
JP33560893A
Publication Date:
August 01, 1995
Filing Date:
December 28, 1993
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ASAHI GLASS CO LTD
International Classes:
C08L63/00; C08G59/32; C08G59/40; C08K5/54; C08K5/5435; C08K5/544; (IPC1-7): C08L63/00; C08G59/40; C08K5/54
Attorney, Agent or Firm:
Kenji Izumina