Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JPH09132637
Kind Code:
A
Abstract:
To provide a curable epoxy resin composition which can be moisture- cured at room temperature.
This curable composition essentially comprises an epoxy resin having one or more epoxy groups in the molecule, a protected-amino-containing compound which can be easily hydrolyzed in the presence of water into a free- amino-containing compound, and a silane-modified compound obtained by reacting a polyether polyepoxy obtained by epoxidizing the terminals of a polyetherpolyol and an aminosilane compound and/or a mercaptosilane compound each of which has hydrolyzable alkoxyl groups at the terminals in an equivalent ratio (epoxy groups/(amino groups and/or the mercapto groups)=1/1.0 to 1/1.5.
Inventors:
OGAWA AKIO
SUZUKI HIROSHI
BABA KAZUTAKA
MUTO KIYOSHI
SUZUKI HIROSHI
BABA KAZUTAKA
MUTO KIYOSHI
Application Number:
JP29266995A
Publication Date:
May 20, 1997
Filing Date:
November 10, 1995
Export Citation:
Assignee:
ASAHI DENKA KOGYO KK
ACR CO LTD
ACR CO LTD
International Classes:
C08L63/00; C08G59/14; C08G59/50; C09D163/00; (IPC1-7): C08G59/50; C08G59/14; C08L63/00
Attorney, Agent or Firm:
Kaoru Furuya (3 outside)