Title:
ポリフェニレンエーテルを含む硬化性組成物、ドライフィルム、プリプレグ、硬化物、積層板、および電子部品
Document Type and Number:
Japanese Patent JP7369580
Kind Code:
B2
Abstract:
To provide a curable composition which, while maintaining low dielectric properties, is soluble in various solvents (organic solvents other than organic solvents having high toxicity, for example, cyclohexanone) and a film by curing it has excellent mechanical properties and low linear expansion properties.SOLUTION: A curable composition is characterized by containing: polyphenylene ether which is obtained from raw material phenols including phenols that satisfy at least Condition 1, has a slope calculated in a conformation plot of less than 0.6, and contains a functional group that contains an unsaturated carbon bond; and a compound that contains at least one maleimide group in one molecule.SELECTED DRAWING: None
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Inventors:
Asami Nozaka
Satoko Matsumura
Nobuhiro Ishikawa
Satoko Matsumura
Nobuhiro Ishikawa
Application Number:
JP2019180449A
Publication Date:
October 26, 2023
Filing Date:
September 30, 2019
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
C08L71/12; B32B15/08; C08J5/24; C08K5/3415; C08K5/3477; C08L35/00
Domestic Patent References:
| JP2006057079A | ||||
| JP2006316091A | ||||
| JP2003160662A | ||||
| JP2014101398A | ||||
| JP2017206578A |
Attorney, Agent or Firm:
Atsushi Ito