Title:
CURABLE EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2015110772
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition capable of forming a cured product which has high heat resistance, light resistance, and thermal shock resistance and is capable of particularly improving conduction characteristics and moisture absorption reflow resistance of an optical semiconductor device at a high temperature.SOLUTION: The curable epoxy resin composition contains: an alicyclic epoxy compound (A); an isocyanuric acid derivative (B) having one or more oxirane rings in the molecule; and an isocyanuric acid derivative (C) having one or more alkenyl groups in the molecule (excluding ones corresponding to the isocyanuric acid derivative (B) having one or more oxirane rings in the molecule).
Inventors:
SUZUKI HIROSE
Application Number:
JP2014226916A
Publication Date:
June 18, 2015
Filing Date:
November 07, 2014
Export Citation:
Assignee:
DAICEL CORP
International Classes:
C08G59/20; C08K5/3492; C08L21/00; C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Yukihisa Goto
Hiroshi Yoshida
Hiroshi Yoshida
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