Title:
CURABLE IMPRINTING COMPOSITION, IMPRINT METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023000133
Kind Code:
A
Abstract:
To provide a semiconductor device improved in mechanical strength of an insulation layer by improving a mechanical strength of a hardened material obtained by a curable imprinting composition and an imprint method.SOLUTION: A semiconductor device includes: a substrate Sub; an insulation layer 2 that is provided above the substrate Sub, and contains a cellulose fiber; and a conductive layer that is provided inside the insulation layer 2.SELECTED DRAWING: Figure 1
Inventors:
OKABE KASUMI
HIGUCHI TSUYOSHI
HIGUCHI TSUYOSHI
Application Number:
JP2021100771A
Publication Date:
January 04, 2023
Filing Date:
June 17, 2021
Export Citation:
Assignee:
KIOXIA CORP
International Classes:
H01L21/027; B29C59/02
Attorney, Agent or Firm:
Masatoshi Kurata
Nobuhisa Nogawa
Ryuji Mine
Naoki Kono
Sanae Kaneko
Nobuhisa Nogawa
Ryuji Mine
Naoki Kono
Sanae Kaneko