Title:
硬化型感光性樹脂組成物、硬化物、レジストパターン、レジストパターンの製造方法、半導体素子及び電子デバイス
Document Type and Number:
Japanese Patent JP7311002
Kind Code:
B2
Abstract:
A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.
Inventors:
Takashi Yamaguchi
Taiyo Nakamura
Atsushi Shioya
▲杉▼本 啓輔
Manaka Yamashita
田▲崎▼ 崇司
Taiyo Nakamura
Atsushi Shioya
▲杉▼本 啓輔
Manaka Yamashita
田▲崎▼ 崇司
Application Number:
JP2022153218A
Publication Date:
July 19, 2023
Filing Date:
September 27, 2022
Export Citation:
Assignee:
Arakawa Chemical Industry Co., Ltd.
International Classes:
G03F7/037; C08F2/44; C08F22/40; C08F279/02; C08F283/00; C08G73/10; G03F7/004; G03F7/027
Domestic Patent References:
| JP2013083958A |