PURPOSE: A curable polyimide resin composition having excellent solvent resistance and low moisture absorption and being suitable as a protective coating material for semiconductor devices, prepared by mixing a polyimide or a polyamide-acid with a curable resin.
CONSTITUTION: An organic tetracarboxylic acid dianhydride (e.g., pyromellitic dianhydride, benzophenonetetracarboxylic dianhydride) is reacted with an organic diamine (e.g., m-phenylenediamine, 1,5-diaminonaphthalene) to produce a polyamide-acid or the latter is further ring-closed by dehydration to form a polyimide. Then, the resulting polyimide or polyamide-acid is mixed with a curable resin (e.g., phenol resin, epoxy resin) to form the purpose curable polyimide resin composition. Thus, the polyimide skeleton which is poor in solvent resistance is fixed in a three-dimensional network, and its solvent resistance is improved.
FUJISAKI KOUJI
NISHIKAWA AKIO
MAKINO DAISUKE
HITACHI CHEMICAL CO LTD