Title:
CURABLE POLYMER COMPOSITION AND MULTILAYER CIRCUIT BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP3899757
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a curable polymer composition having excellent curing workability and to provide a multilayer printed circuit board having excellent electrical insulating properties, chemical resistance, heat resistance and adhesivity in which a cured material of the curable polymer composition is embedded in recessed parts such as through hole and via hole (namely, excellent lamination).
SOLUTION: The curable polymer composition comprises an alicyclic olefin polymer, a curing agent and a liquid epoxy resin or a curable polymer composition having a melt viscosity change of 1% to 300% between a melt viscosity after allowing the curable polymer composition to stand on an inner layer substrate for 10 minutes at a temperature for laminating the curable polymer composition and a melt viscosity before allowing the composition at the temperature is laminated to the inner layer substrate, and which is cured to form an electrical insulating layer, and an electric conductor circuit is formed on the electrical insulating layer to give the objective multilayer printed circuit board.
Inventors:
Yasuhiro Wakisaka
Takeka Kato
Kurakata Hiroshi
Takeka Kato
Kurakata Hiroshi
Application Number:
JP36032399A
Publication Date:
March 28, 2007
Filing Date:
December 20, 1999
Export Citation:
Assignee:
Zeon Corporation
International Classes:
C08L65/00; C08L45/00; C08L63/00; H05K3/46; (IPC1-7): C08L65/00; C08L45/00; C08L63/00; H05K3/46
Domestic Patent References:
| JP6240197A | ||||
| JP8067745A | ||||
| JP2001139776A | ||||
| JP2001139777A | ||||
| JP2001160689A |
Foreign References:
| WO1998015595A1 | ||||
| WO2001004213A1 |
Attorney, Agent or Firm:
Yukio Uchida
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