CURABLE POLYPHENYLENE ETHER-BASED RESIN COMPOSITION

Japanese Patent JPH0488054

A

PURPOSE:To obtain the subject composition capable of producing a cured material excellent in chemical resistance, dielectric properties, etc., and suitable for an dielectric material, an insulating material, etc., by blending a polyphenylene ether resin containing unsaturated groups with trially (iso)cyanate and a styrene-based thermoplastic resin, etc. CONSTITUTION:(A) A polyphenylene ether resin containing unsaturated groups in an amount of 98-40 pts.wt. based on 100 pts.wt. total amount of (A) and (B) is blended with (B) a triisocyanurate and/or trially cyanurate in an amount of 2-60 pts.wt. based on 100 pts.wt. total amount of (A) and (B) and (C) a styrene-based thermoplastic resin and/or polybutadiene rubber in an amount of 10-90 pts.wt. based on 100 pts.wt. total amount of (A), (B), (C). The above- mentioned composition is excellently used in a form of a film and a cured composite material can be obtained from the above-mentioned composition and a base material. In addition, a laminated material (plate) can be obtained by combining a metal foil and/or a metal base therewith.

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KATAYOSE TERUO
ISHII YOSHIYUKI

JP20248990A

March 19, 1992

August 01, 1990

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ASAHI CHEMICAL IND

B32B5/18; B32B15/08; C08F299/02; C08J5/18; C08K5/3477; C08L9/00; C08L21/00; C08L25/08; C08L71/00; C08L71/12; H05K1/03; (IPC1-7): B32B5/18; B32B15/08; C08F299/02; C08K5/3477; C08L9/00; C08L25/08; C08L71/12

Nozaki

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