To obtain a polyphenylene ether that is useful as an electric and an electronic materials, especially as a solder resist material, is easily crosslinked and provides a cured material having excellent heat resistance, dielectric characteristics and chemical resistance and a curable resin composition that is useful as a solder resist for FPC and has flexibility or ductility.
(i) The polyphenylene ether has a structure represented by general formula (1), a structure represented by general formula (2) and a structure represented by general formula (3) and contains one or more kinds of functional groups selected from the group consisting of a hydroxy group, an epoxy group, an allyl group, an acryloyl group, a methacryloyl group and a cyanate group. (ii) The curable resin composition comprises the curable polyphenylene ether (A), a curing agent (B) and, if necessary, a curable resin (C) and/or a flexibility imparting agent (D). (iii) The cured material is obtained by curing the curable resin composition.
Nobuhiko Ozawa
Atsushi Hayashi
Next Patent: POLYPHENYLENE ETHER, METHOD FOR PRODUCING THE SAME AND USE