PURPOSE: To obtain the subject curable composition, comprising a specific polyether resin, triallyl (iso)cyanurate, silica, a hydrogenated block copolymer and a brominated aromatic compound, excellent in film-forming properties, adhesion, flame retardancy, chemical and heat resistances and dielectric characteristics and useful as printed wiring boards, etc.

CONSTITUTION: This resin composition is a curable polyphenylene ethereal resin composition comprises (A) 98-40 pts.wt. polyphenylene ether containing unsaturated groups, (B) 2-60 pts.wt. triallyl (iso)cyanurate, (C) 10-400 pts.wt. silica, (D) 1-50 pts.wt. hydrogenated block copolymer obtained by hydrogenating a block copolymer comprising a polymer block consisting essentially of a vinyl aromatic compound and a polymer block consisting essentially of a conjugated diene compound and (E) 5-50 pts.wt. brominated aromatic compound containing imide ring. The total amount of the components (A) and (B) is 100 pts.wt.