Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LIGHT/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2016029186
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a light/moisture-curable resin composition having excellent shape retention properties, adhesive properties, rapid curing properties and coating properties, and provide an adhesive for electronic components and an adhesive for display devices prepared with the light/moisture-curable resin composition.SOLUTION: The present invention is a light/moisture-curable resin composition containing a radically polymerizable compound, a moisture-curable urethane resin, a photo-radical polymerization initiator and a filler.SELECTED DRAWING: None

Inventors:
TAKAHASHI TORU
YUKI AKIRA
KUNIHIRO YOSHITAKA
KIDA TAKUMI
Application Number:
JP2015224959A
Publication Date:
March 03, 2016
Filing Date:
November 17, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEKISUI CHEM CO LTD
International Classes:
C08F2/48; C08F2/44; C09J4/00; C09J11/04; C09J11/06; C09J175/04
Domestic Patent References:
JP2010248347A2010-11-04
JP2001064543A2001-03-13
JP2002241461A2002-08-28
JP2008031246A2008-02-14
Attorney, Agent or Firm:
特許業務法人 安富国際特許事務所