Title:
硬化性樹脂組成物、接着剤、接着フィルム、回路基板、層間絶縁材料、及び、プリント配線板
Document Type and Number:
Japanese Patent JP7018942
Kind Code:
B2
Abstract:
The present invention aims to provide a curable resin composition excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. The present invention also aims to provide an adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition.Provided is a curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less.
Inventors:
Sayaka Wakioka
Yuta Otowa
Kohei Takeda
Shindo sincerity
Takashi Shinshiro
Yuko Kawahara
Baba scholarship
Tatsufumi Hayashi
Yuta Otowa
Kohei Takeda
Shindo sincerity
Takashi Shinshiro
Yuko Kawahara
Baba scholarship
Tatsufumi Hayashi
Application Number:
JP2019519337A
Publication Date:
February 14, 2022
Filing Date:
March 15, 2019
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08L79/08; C08G59/40; C08L63/00; C09J11/08; C09J179/08; C09J201/02; H05K1/03; H05K3/46
Domestic Patent References:
| JP2015117278A | ||||
| JP201816793A | ||||
| JP2004323728A | ||||
| JP2001316469A | ||||
| JP2016147946A |
Foreign References:
| WO2010128667A1 |
Attorney, Agent or Firm:
Patent Business Corporation Yasutomi International Patent Office