To obtain a curable resin composition containing a thermoplastic polyhydroxypolyether resin having flame retardance, a copper foil with an adhesive for a printed wiring board, an insulating film, etc., formed from the composition.
This curable composition comprises a component (A) composed of a polyhydroxypolyether resin which is represented by general formula (1) (X is a phosphorus-containing aromatic group; Z is a hydrogen atom or a glycidyl group; n is a value of ≥21), has 10,000 to 200,000 number-average molecular weight and has 1 wt.%-6 wt.% phosphorus content, a component (B) composed of an epoxy resin and a component (C) composed of a curing agent in the ratio of the component (A) to the components (A)+(B) of 5 wt.%-95 wt.% The copper foil with an adhesive for a printed wiring board, the insulating film and the resist material are formed from the curable resin composition.
ASANO CHIAKI
SATO HIROSHI
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