Title:
CURABLE RESIN COMPOSITION, CURED FILM, CURED FILM FORMING METHOD AND DISPLAY ELEMENT
Document Type and Number:
Japanese Patent JP2019038899
Kind Code:
A
Abstract:
To provide a curable resin composition that achieves high speed application properties, and can form a cured film having sufficient light transmittance, resolution, development adhesion, chemical resistance, and curing adhesion and being excellent in inhibition of double exposure unevenness; a cured film formed from the curable resin composition and a method of forming the same; and a display element having the cured film.SOLUTION: The present invention provides a curable resin composition containing (A) a polymer containing a structural unit having a carboxyl group, (B) a compound having a structural unit represented by the following formula (1) and (C) a solvent having a 25°C viscosity of 1.5 mPa s or less, by 98 mass% or more of the total solvent content of the composition.SELECTED DRAWING: None
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Inventors:
OKUDA TSUTOMU
MISHIMA ERI
MATSUMOTO HIDEYUKI
NAKAGAWA TSUYOSHI
NAKANISHI TAKUYA
HONDA AKIHISA
MISHIMA ERI
MATSUMOTO HIDEYUKI
NAKAGAWA TSUYOSHI
NAKANISHI TAKUYA
HONDA AKIHISA
Application Number:
JP2017160248A
Publication Date:
March 14, 2019
Filing Date:
August 23, 2017
Export Citation:
Assignee:
JSR CORP
International Classes:
C08F299/02; C08F2/48; C08K5/06; C08L33/02; C08L63/10; C08L101/02; G02F1/1333; G03F7/004; G03F7/027