Title:
硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
Document Type and Number:
Japanese Patent JP7194278
Kind Code:
B2
Abstract:
A curable resin composition which comprises at least one resin selected from the group consisting of polyimide precursors, poly(amide-imide) precursors, and polybenzoxazole precursors, anions having a structure represented by formula (1-1) or (1-2), and organic cations; a cured film obtained by curing the curable resin composition; a layered product including the cured film; a method for producing the cured film; and a semiconductor device including the cured film or the layered product.
Inventors:
Atsushi Nozaki
Yu Iwai
Yu Iwai
Application Number:
JP2021526907A
Publication Date:
December 21, 2022
Filing Date:
June 19, 2020
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
C08G73/06; B32B15/088; C07C233/01; C07C233/57; C07C233/64; C08F2/44; C08F283/04; C08K5/20; C08L79/04; C08L79/08; C09K3/00; G03F7/20; H01L21/312
Domestic Patent References:
| JP2014055114A |
Foreign References:
| US20180327534 |
Attorney, Agent or Firm:
Sykes Patent Attorney Corporation
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