Title:
硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
Document Type and Number:
Japanese Patent JP7333383
Kind Code:
B2
Abstract:
The present invention provides: a curable resin composition having at least one polymer precursor selected from the group comprising a polyimide precursor and a polybenzoxazole precursor, and a hydrogen bonding nitrogen atom, and including a polymer compound having a group including two or more ethylene unsaturated groups, wherein the radical polymer group value derived from a compound which has a radical polymer group that has a molecular weight of 2,000 or less relative to the total solid component of the composition is 0.25-4.35 mmol/g; a cured film obtained by curing the curable resin composition; a laminate including the cured film; a method for manufacturing the cured film; and a semiconductor device including the cured film or the laminate.
Inventors:
Haruna Inoue
Toshie Qingdao
Toshie Qingdao
Application Number:
JP2021509069A
Publication Date:
August 24, 2023
Filing Date:
March 16, 2020
Export Citation:
Assignee:
Fujifilm Corporation
International Classes:
C08F283/04; B32B15/088; C08F290/14; C08G73/10; C08G73/12; G03F7/004; G03F7/027; G03F7/037; G03F7/20; G03F7/40; H01L21/312
Domestic Patent References:
| JP2009109987A | ||||
| JP11282155A | ||||
| JP2010266814A | ||||
| JP2002212192A |
Foreign References:
| WO2017002858A1 |
Attorney, Agent or Firm:
Sykes Patent Attorney Corporation