To provide a thermosetting resin composition and a cured product of the composition, the composition having excellent fluidity of the composition, and achieving reliability in moisture resistance suitable to a material relating to electronic components of recent years and high flame retardancy while the composition is halogen-free for environmental harmony; to provide a semiconductor sealing material using the composition; and to provide a phenolic resin and an epoxy resin that give the above described performances.
A phenolic resin having the following resin structure is used as a raw material of an epoxy resin or a curing agent for an epoxy resin. The resin structure of the phenolic resin comprises a resin structure (α) of a plurality of phenolic hydroxy group-containing aromatic skeletons (ph) bonded through an alkylidene group or a methylene group that contains an aromatic hydrocarbon structure, wherein: a naphthyl methyl group or an antonyl methyl group is present in an aromatic nucleus of the resin structure; and 5 to 50 mol% of phenolic hydroxy groups in the resin structure (α) are modified into a naphthyl methyl ether or an antonyl methyl ether.
HIROTA YOSUKE
TAKAHASHI YOSHIYUKI
NAGAE NORIO
NAKAMURA SHINYA
| JP2005114921A | 2005-04-28 | |||
| JP2009197040A | 2009-09-03 | |||
| JP2012233125A | 2012-11-29 | |||
| JP2012246472A | 2012-12-13 | |||
| JP2012077120A | 2012-04-19 |
| WO2012014715A1 | 2012-02-02 |
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