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Title:
CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT
Document Type and Number:
Japanese Patent JP2022102140
Kind Code:
A
Abstract:
To provide a cured product excellent in heat resistance and dielectric characteristics (low dielectric characteristics).SOLUTION: A curable resin is represented by the following general formula (1) (where Ra and Rb each independently represent a C1-12 alkyl group, an aryl group, an aralkyl group or a cycloalkyl group; Rc and Rd each independently represent hydrogen, a C1-12 alkyl group, an aryl group, an aralkyl group or a cycloalkyl group; X represents a vinylbenzyl ether group, a (meth)acryloyloxy group or an allyl ether group; and m represents an integer of 0-3).SELECTED DRAWING: None

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Inventors:
YANG LICHEN
MATSUOKA RYUICHI
KAMINARI HIROYOSHI
Application Number:
JP2020216694A
Publication Date:
July 07, 2022
Filing Date:
December 25, 2020
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C07C43/20; C07C69/54; C08F12/34; C08F16/32; C08F20/20
Attorney, Agent or Firm:
Ogawa Shinji
Akihiro Iwamoto
Takayuki Ohno



 
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