Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER
Document Type and Number:
Japanese Patent JP2023084278
Kind Code:
A
Abstract:
To provide: a curable resin composition which has high photosensitivity and can form a cured product excellent in heat resistance and dielectric properties; and a cured product, an insulating material and a resist member of the curable resin composition.SOLUTION: A curable resin composition contains a resin (A) having an acid group and a polymerizable unsaturated group, and a curable resin (B) represented by a general formula (1) in the figure. [Z is C2-15 hydrocarbon, X is a polymerizable unsaturated group, n is an integer from 3 to 6, and m is an integer from 0 to 3.]SELECTED DRAWING: Figure 1
Inventors:
YAMADA SHUNSUKE
YANG LICHEN
MATSUOKA RYUICHI
KAMINARI HIROYOSHI
YANG LICHEN
MATSUOKA RYUICHI
KAMINARI HIROYOSHI
Application Number:
JP2021198356A
Publication Date:
June 19, 2023
Filing Date:
December 07, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08L57/10; C08F236/20; C08L47/00
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno