Title:
硬化性樹脂組成物、その硬化物、及びその硬化物を含む構造体
Document Type and Number:
Japanese Patent JP7153635
Kind Code:
B2
Abstract:
A curable resin composition, which has excellent flowability and reactivity at the time of molding, with which a highly reliable cured product which has excellent heat resistance can be obtained by curing is provided.A curable resin composition comprising a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1):where R1and R2each independently represent a hydrogen atom, a C1-10alkyl group, a C1-2alkoxy group, or a hydroxy group, Q represents a C5-10cycloalkylene group or a divalent organic group containing an alicyclic fused ring, and Y is an alkenyl group.
Inventors:
Aoi Hasegawa
Masatoshi Mori
Kei Ishibashi
Masatoshi Mori
Kei Ishibashi
Application Number:
JP2019513549A
Publication Date:
October 14, 2022
Filing Date:
April 04, 2018
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
C08F212/34; C08F222/40; C08K5/3417; C08L65/02
Domestic Patent References:
| JP6093047A | ||||
| JP2015117375A | ||||
| JP6399224A | ||||
| JP2014169428A |
Foreign References:
| CN103360764A | ||||
| WO2016104195A1 |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Masatoshi Takahashi
Naonori Koda
Hajime Kawahara
Shinji Mihashi
Masatoshi Takahashi
Naonori Koda
Hajime Kawahara