Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2023057389
Kind Code:
A
Abstract:
To provide a curable resin composition that can form a cured product having excellent peel strength with respect to a conductor layer or the like.SOLUTION: A curable resin composition comprises: a polyphenylene ether comprising a functional group with an unsaturated carbon bond, a silica surface-treated with a coupling agent comprising a functional group with an unsaturated carbon bond, a silicon compound comprising two or more SiH groups in one molecule, and a peroxide. In the curable resin composition, the content of the silicon compound is 0.1 pt.mass or more and less than 5 pts.mass when the content of the silica is 100 pts.mass.SELECTED DRAWING: None
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Inventors:
MISHIMA SHOKO
SEKIGUCHI SHOYA
ISHIKAWA NOBUHIRO
OSHIRO KOTA
SEKIGUCHI SHOYA
ISHIKAWA NOBUHIRO
OSHIRO KOTA
Application Number:
JP2021166899A
Publication Date:
April 21, 2023
Filing Date:
October 11, 2021
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD
International Classes:
C08F299/02; C08K3/36; C08K5/14; C08K9/06; C08L55/00; C08L71/12; C08L83/05
Attorney, Agent or Firm:
Atsushi Ito