Title:
硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
Document Type and Number:
Japanese Patent JP6626275
Kind Code:
B2
Abstract:
To provide a curable resin composition having excellent heat resistance, a dry film, a cured product, and a printed wiring board having the cured product.SOLUTION: The present invention provides a curable resin composition for inkjet printing having a curable resin, and a colorant represented by the following formula (1) (where, R1 and R2 each denote an alkyl group, and m and n each denote an integer of 0-6).SELECTED DRAWING: None
Inventors:
Ueda Chiho
Yu Shimura
Yu Shimura
Application Number:
JP2015124764A
Publication Date:
December 25, 2019
Filing Date:
June 22, 2015
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
C08L63/00; C08F2/44; C08F290/14; C09B23/00; G03F7/004; H05K3/28
Domestic Patent References:
| JP2007003807A | ||||
| JP2000007974A | ||||
| JP2001109197A | ||||
| JP2006184686A | ||||
| JP2009258613A |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro