Title:
硬化性樹脂組成物、ドライフィルム、硬化物、配線板及び電子部品
Document Type and Number:
Japanese Patent JP7168443
Kind Code:
B2
Abstract:
To provide a curable resin composition suitable for obtaining excellent mechanical characteristics and low thermal expansion and electric insulation reliability while keeping excellent characteristics such as adhesion, chemical resistance and heat resistance inherent to an epoxy resin as a cured product, a dry film and a cured product using the curable composition, and a wiring board and an electronic component using the cured product.SOLUTION: A curable resin composition contains an epoxy resin, a curing agent, an inorganic filler, a cellulose nanofiber, a (meth)acrylic copolymer (A) having a weight average molecular weight of 20,000 or more, and a (meth)acrylic copolymer (B) having a weight average molecular weight of less than 20,000.SELECTED DRAWING: Figure 1
Inventors:
Natsuna Endo
Toshiaki Masuda
Toshiaki Masuda
Application Number:
JP2018246955A
Publication Date:
November 09, 2022
Filing Date:
December 28, 2018
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
C08L63/00; C08G59/62; C08K3/013; C08L1/00; C08L33/04; H05K1/03
Domestic Patent References:
| JP2009069612A | ||||
| JP5078591A | ||||
| JP2016089077A | ||||
| JP2014162880A |
Foreign References:
| WO2018030465A1 | ||||
| WO2018012643A1 | ||||
| WO2017141779A1 | ||||
| WO2015163405A1 |
Attorney, Agent or Firm:
Atsushi Ito