硬化性樹脂組成物、並びにこれを用いたフィルム、成形品、プリプレグ及び繊維強化プラスチック

Title:

硬化性樹脂組成物、並びにこれを用いたフィルム、成形品、プリプレグ及び繊維強化プラスチック

Document Type and Number:

Japanese Patent JP6993549

Kind Code:

B2

Abstract:

A curable resin composition including components (A), (B), (C) and (D) below:component (A): a bisphenol epoxy resin with a softening point of 80° C. or more,component (B): a bisphenol epoxy resin which is liquid at 25° C.,component (C): a bi- or more-functional (meth)acrylate compound, andcomponent (D): a curing agent.

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Inventors:

Hisaya Ushiyama
Exit Nao
Kenichi Watanabe
Juichi Fujimoto

Application Number:

JP2019211788A

Publication Date:

February 04, 2022

Filing Date:

November 22, 2019

Export Citation:

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Assignee:

Mitsubishi Chemical Corporation

International Classes:

C08G59/18; B29C70/16; B29C70/30; C08G59/26; C08J5/24

Domestic Patent References:

JP4130141A

Foreign References:

WO2016035459A1

Attorney, Agent or Firm:

田▲崎▼ 聡
Shunsuke Fushimi
Kazunori Onami

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