Title:
硬化性樹脂組成物、そのドライフィルムおよび硬化物、それらを用いたプリント配線板
Document Type and Number:
Japanese Patent JP7084185
Kind Code:
B2
Abstract:
To provide a highly sensitive curable resin composition that has both of heat resistance of a rigid substrate SR and flexibility of an FPC SR and accommodates a direct drawing method.SOLUTION: A curable resin composition contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, and (C) a photosensitive monomer, the (B) photopolymerization initiator containing (B1) an oxime ester photopolymerization initiator and (B2) a titanocene photopolymerization initiator, the (C) photosensitive monomer containing (C1) an alkylene oxide-added bifunctional photosensitive monomer, (C2) an alkanediol skeleton-containing bifunctional photosensitive monomer, and (C3) a photosensitive monomer having three or more functional groups.SELECTED DRAWING: None
Inventors:
Shohei Makita
Yasuyo Kanazawa
Yasuyo Kanazawa
Application Number:
JP2018069457A
Publication Date:
June 14, 2022
Filing Date:
March 30, 2018
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
G03F7/031; G03F7/004; G03F7/027; G03F7/029; H05K3/28
Domestic Patent References:
| JP2017156590A | ||||
| JP2011013622A | ||||
| JP2005182004A | ||||
| JP2009086460A | ||||
| JP2000263959A | ||||
| JP2011215366A |
Foreign References:
| WO2009116401A1 | ||||
| WO2011037182A1 |
Attorney, Agent or Firm:
Atsushi Ito