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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION, ITS PRODUCTION, AND ITS USE
Document Type and Number:
Japanese Patent JPH07316230
Kind Code:
A
Abstract:

PURPOSE: To obtain a curable resin compsn. excellent in adhesion to a polyolefin substrate by subjecting a carboxylic anhydride and a hydroxylated (meth) acryloyl compd. to partial esterification.

CONSTITUTION: A curable resin compsn. mainly comprising a partial esterification product is obtd. by subjecting a carboxylic anhydride (pref. alicyclic or arom.) and a hydroxylated (meth)acryloyl compd. in an equivalent ratio of acid anhydride group of the former compd. to hydroxyl group of the latter of (1:1)-(1:2) to esterification. When necessary, 100 pts.wt. partial esterification product is compounded with up to 45 pts.wt. (meth)acrylic resin to give a curable resin compsn. A heat-sensitive adhesive contg. the compsn. can be pref. used by applying it to a polyolefin substrate, curing it with an active energy ray to form a cured resin layer, placing another adherend onto the resin layer, and heating it.


Inventors:
HATA KAZUYUKI
KADA MASUMI
Application Number:
JP11132394A
Publication Date:
December 05, 1995
Filing Date:
May 25, 1994
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
C09J7/02; C08F2/44; C08F20/26; C09J4/02; C09J133/00; (IPC1-7): C08F20/26; C08F2/44; C09J7/02
Attorney, Agent or Firm:
Takaya Yamamoto