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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION AND MICROSTRUCTURAL SHAPES
Document Type and Number:
Japanese Patent JP2003286316
Kind Code:
A
Abstract:

To provide microstructural shapes posing no problems related to shrinkage, incomplete curing or residual bubbles during the curing process or related to film fracture, film exfoliation, shape deformation and distortion during the shaping process, high in microstructural precision, sufficient in strength and heat resistance, and to provide a curable resin composition easily producing the shapes and precision instruments using the shapes.

The curable resin composition comprises (A) a compound having an alicylic hydrocarbon skeleton and a radical polymerizable group and (B) an initiator as essential components. The microstructural shapes are characterized in that they are obtained from the curable resin composition with microstructures formed by application of a die to the cured surface, and the precision instruments are manufactured by using the shapes.


Inventors:
Kitamura, Kyoji
Hasegawa, Yuki
Application Number:
JP2002000326966
Publication Date:
October 10, 2003
Filing Date:
November 11, 2002
Export Citation:
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Assignee:
OMRON CORP
International Classes:
C08J5/18; C08F4/32; C08F20/00; C08J5/18; C08F4/00; C08F20/00; (IPC1-7): C08F20/00; C08F4/32; C08J5/18