Title:
CURABLE RESIN COMPOSITION FOR MOLDED ARTICLES, MOLDED ARTICLE, AND PRODUCTION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2009256586
Kind Code:
A
Abstract:
To provide: a curable resin composition for molded articles capable of producing a molded article excellent in fundamental performances such as heat resistance and having satisfactory optical characteristics such as transparency, and of making excellent the mold-release property of the molded article when the molded article is taken out of a mold; a molded article produced by molding the curable resin composition; and a production method thereof.
This curable resin composition for molded articles is a curable resin composition for molded articles containing an epoxy resin and further containing as an essential component, a silicon compound having a polyoxyalkylene chain and/or an aryl group.
Inventors:
NAKAMURA JUNICHI
TSUJINO YASUNORI
MATSUMOTO AI
HIRAUCHI TATSUFUMI
TSUJINO YASUNORI
MATSUMOTO AI
HIRAUCHI TATSUFUMI
Application Number:
JP2008247572A
Publication Date:
November 05, 2009
Filing Date:
September 26, 2008
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
C08L63/00
Domestic Patent References:
| JP2003268198A | 2003-09-25 | |||
| JP2006182801A | 2006-07-13 | |||
| JPH11124490A | 1999-05-11 | |||
| JP2009024041A | 2009-02-05 | |||
| JP2009013213A | 2009-01-22 | |||
| JP2001207019A | 2001-07-31 | |||
| JP2008001841A | 2008-01-10 |
Attorney, Agent or Firm:
Yasuo Yasutomi
Takanori Tamai
Takanori Tamai