Title:
CURABLE RESIN COMPOSITION, MULTILAYERED PRINTED WIRING BOARD USING THE SAME, AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3290295
Kind Code:
B2
Abstract:
PURPOSE: To prepare a curable resin compsn. which can form an insulating layer having excellent adhesion to a conductor layer and excellent heat resistance by incorporating two epoxy resins different from each other in epoxy equivalent and a particular curing agent for an epoxy resin.
CONSTITUTION: A curable resin compsn. comprising (A) an epoxy resin and (B) a curing agent for an epoxy resin as essential components, wherein, in order that a cured coating is decomposed or dissolved with a roughening agent to provide a roughened irregular surface, resin (A) comprises (a) a bisphenol A epoxy resin having an epoxy equivalent of not less than 400 and (b) an epoxy resin having an epoxy equivalent of less than 400 and two or more epoxy groups per molecule, the weight ratio of resin (a) to resin (b) being (30:70) to (90:100), the agent as component (B) contg. two or more active hydrogen atoms per molecule. A multilayer printed wiring board is prepared by coating the compsn., heat-curing the coating to form an insulating layer, treating the surface of the insulating layer with a roughening agent to form an irregular surface, and forming a conductor layer on the roughened surface.
Inventors:
Akio Sekimoto
Shinichi Yamada
Shinichi Yamada
Application Number:
JP12332494A
Publication Date:
June 10, 2002
Filing Date:
May 13, 1994
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
C08K3/00; C08G59/22; C08G59/38; C08L63/00; H05K3/46; C08L9/00; C08L17/00; (IPC1-7): C08L63/00; C08K3/00; H05K3/46
Domestic Patent References:
| JP616778A | ||||
| JP620519A | ||||
| JP673164A | ||||
| JP675231A | ||||
| JP6100660A | ||||
| JP6106676A | ||||
| JP6106674A | ||||
| JP63235384A | ||||
| JP7304931A | ||||
| JP46116B2 |
Attorney, Agent or Firm:
▲吉▼田 繁喜