To provide a printed wiring board which can be produced in a good yield, and, by impregnating a thin fiber substrate with a resin having excellent adhesion to a metal foil and a fiber substrate and high flexibility, has superior dimensional stability and heat resistance, is bendable, and prevents a resin powder from falling upon processing, as well as to provide a prepreg, a laminate, a metal foil with an adhesive layer, a film sheet and a printed wiring board using these.

This curable resin composition comprises an acrylic rubber (A), a thermosetting resin (B) and a filler (C).